Thin Films
Oxide, Nitride, Sputtering, Evaporation

Metal Deposition: Sputtering and Evaporation. Diameter up to 12 inch.

Al, Au, Al2O3, Ag, C, Co, CoNi, CoSi, Cr, CrO2, CrO2 TiO3, CrSi, Cu, CuNi, Mo, Ge, Ni, NiCr, Pd, Pt, Quartz, Glass, Si, SiC, SiO2, Si3N4, Ta, TaO, TaAl, Ti, TiN, TiNi, TiO2, TiSi, V, W, WSi, WTi, Zr

Thermal Oxidation Wet, Dry +/-5%

Backside Oxidation Removal

Silicon Nitride

Stoichiometric LPCVD nitride

Low stress LPCVD nitride

Super low stress LPCVD nitride

If you have a specific need not mentioned above for thin films, please contact PCA.