2” to 12” Wafer Strip and Reclaim Services

PCA does wafer stripping, cleaning, reclaiming, thin films and inspection in house. We can provide 12hour turnaround for you.

Just think how much cost saving can be achieved by reclaiming all your reject wafers several times. In 1974 we developed a process and fulfilled the need for reclaiming wafers. We have capacity to supply several thousand wafers per work day. Our fast turnaround using our trucks is usually one day or we can ship worldwide. Give us the opportunity to demonstrate what we can do for cost containment and centralizing inventory control.

We can help you meet your monthly needs working with inventory control programs so that you know the location and condition of all your wafers. It’s quite convenient and cost effective if you let us handle your reclaim wafer inventory by our computerized management systems on a long-term basis. We also provide technical solutions for customers’ special requirements.

Out typical wafer strip and reclaim procedures are:

Step 1 Receiving
PCA pick up wafers from customers

Step 2 Incoming Inspection
PCA counts wafers, a report of “Wafer conditions before Process” is made, (wafers which have chips or other damages can not be processed).

Step 3 Presort
Wafers are sorted by different types of films that need to be removed.
Stripping schedules are designed for multilayered wafers.
Wafers are sorted into different thickness groups if they only need polish then go to Step 6.

Step 4 Strip & etch
Wafers are put in chemical process that removes all existing patterns and films.

Step 5 In Process Quality assurance
Wafers are inspected and sorted.
If wafers need to be polished, go to Step 6.


Step 6 Polishing
We use state-of-art equipment to polish wafers with a prime test wafer surface. We insure surface specs but only take off a few microns from wafers by our low removal polishing technology.

Step 7 SC1/SC2 clean spin/rinse/dry
Wafers are cleaned by SC1 or SC2 process. Particles are removed.

Step 8 Visual inspection
100% Visual inspect wafers.
Send wafers back to Step 6 or Step 7 if necessary.

Step 9 Final inspection
Inspect wafers by KLA 6400 to insure particle count per specification.
Send wafers back to Step 6 or Step 7 if necessary.

Step 10 Final Quality assurance.
Sort wafers.
Provide specified readouts
Wafers are inspected, vacuum packed and delivered, often in the same work day.