Dicing Service

Since our founding in 1969 we have been doing custom dicing of hard materials including silicon, germanium, glass, quartz and ceramics. We have developed proprietary methods of diamond technology, laser cutting, and ultrasonic cutting of all sizes.

Dicing Services Blocks              Dicing Services Wafer

Our pick and place technology is the most modern in the industry. Order ultra-clean dice directly in your process using your preferred packaging. We offer fast shipping to all parts of the globe from our factory in the heart of Silicon Valley.

Contact us to learn more about our dicing services.