Silicon Wafer Dicing & More
Since the founding of PCA in 1969, our facility has been offering high-precision silicon wafer dicing as well as dicing for other hard materials including germanium, glass, quartz, and ceramics. Wafer dicing is the process of sawing a wafer into its respective parts, called die. Over our long history as a recognized pioneer in dicing, our technicians have developed advanced proprietary methods of diamond technology, laser cutting, and ultrasonic cutting of all sizes.
As one of the leading semiconductor wafer manufacturers, our pick-and-place technology is of the most modern in the industry. You can order ultra-clean dice directly in your process using your preferred packaging. The turnaround rate for our wafer dicing services is typically just one day, and we ship to companies around the world from our factory located in the heart of Silicon Valley. Contact us to learn more about the variety of wafer dicing services we offer.
Our pick and place technology is the most modern in the industry. Order ultra-clean dice directly in your process using your preferred packaging. We offer fast shipping to all parts of the globe from our factory in the heart of Silicon Valley.